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US Patent Issued to GlobalFoundries U.S. on June 30 for "Semiconductor device including porous semiconductor material adjacent an isolation structure" (New York, Vermont Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,322, issued on June 30, was assigned to GlobalFoundries U.S. Inc. (Malta, N.Y.). "Semiconductor device including porous semiconductor mater... Read More


US Patent Issued to ROHM on June 30 for "Semiconductor device including an organic film covering a projecting structure" (Japanese Inventor)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,323, issued on June 30, was assigned to ROHM Co. LTD. (Kyoto, Japan). "Semiconductor device including an organic film covering a projecting... Read More


US Patent Issued to Taiwan Semiconductor Manufacturing on June 30 for "Memory devices and methods of manufacturing thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,324, issued on June 30, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Memory devices and methods of manuf... Read More


US Patent Issued to Intel on June 30 for "Integrated circuit structures having raised epitaxy on channel transistor" (Oregon Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,325, issued on June 30, was assigned to Intel Corp. (Santa Clara, Calif.). "Integrated circuit structures having raised epitaxy on channel ... Read More


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on June 30 for "Semiconductor structure and method for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,326, issued on June 30, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor structure and met... Read More


US Patent Issued to Micron Technology on June 30 for "Electronic devices comprising pillars extending through a semiconductor material and adjacent to a source implant region, and related electronic systems and methods" (Idaho Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,327, issued on June 30, was assigned to Micron Technology Inc. (Boise, Idaho). "Electronic devices comprising pillars extending through a s... Read More


US Patent Issued to MITSUBISHI ELECTRIC on June 30 for "Silicon carbide semiconductor device" (Japanese Inventor)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,328, issued on June 30, was assigned to MITSUBISHI ELECTRIC Corp. (Tokyo). "Silicon carbide semiconductor device" was invented by Takaaki T... Read More


US Patent Issued to Hitachi on June 30 for "Silicon carbide semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,329, issued on June 30, was assigned to Hitachi Ltd. (Tokyo). "Silicon carbide semiconductor device" was invented by Takeru Suto (Tokyo), K... Read More


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on June 30 for "Epitaxial features in semiconductor devices and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,330, issued on June 30, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Epitaxial features in semicondu... Read More


US Patent Issued to Powerchip Semiconductor Manufacturing on June 30 for "Semiconductor device and method of forming the same" (Taiwanese Inventor)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,331, issued on June 30, was assigned to Powerchip Semiconductor Manufacturing Corp. (Hsinchu, Taiwan). "Semiconductor device and method of ... Read More